SÜSS MicroTec SE, a leading supplier of equipment and process solutions for the semiconductor industry, paves the way for a novel low-temperature field-assisted bonding technology called Impulse Current Bonding. The technology developed and supplied by Sy&Se SA will be made available on both manual and automatic wafer bonder systems.
The technology will be introduced at the Semicon Europa trade show in Munich. More information on Impulse Current Bonding can be found here: https://icb.suss.com