Semiconductors
The semiconductor industry mainly relies on anodic or complex bonding processes. Sy&Se's ICB offers a seamless alternative, cutting bonding time and reducing temperatures to 100–250°C. It also enables bonding of novel material pairs – crucial for AI chips, photonics, power electronics, optronics, and advanced 5G and 6G telecom.
Mobile Devices and Telecom
The relentless drive for performance in connected mobile devices and telecommunications demands constant innovation in microelectronics, materials science, and manufacturing techniques. Sy&Se's patented technologies deliver cutting-edge solutions to meet these challenges, optimizing displays, HMI, 5G and 6G components, antennas, optronics, and packaging.
Aerospace and MedTech
Aerospace and MedTech demand exceptional reliability and durability in demanding environments. Sy&Se’s low-temperature, high-tightness bonding solutions provide a superior alternative for critical components requiring long-term stability and hermetic sealing. Sy&Se's biocompatible ICB process enables the creation of specialized devices and surgical instruments, ensuring safer and more durable medical innovations.
Watchmaking and Luxury Goods
Watchmaking is the ultimate art of precision assembly where adhesives often pose challenges related to quality and aging. Sy&Se’s ICB offers a cost-effective, durable alternative, for bonding various glass types to sapphire, ceramics, and metals such as stainless steel and titanium. Additionally, it enhances the longevity of luxury goods by improving adhesion for both functional and aesthetic thin-film coatings.