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Our technology is innovative, strong, durable, hermetic, low-stress and works without additives materials.
With its principles discovered in 2016 and developed further by Sy&Se since, the Impulse Current Bonding (ICB) technology allows different glass types to be bonded to ceramics and to metals such as stainless steels, medical titanium and supra-conductive alloys.
Derived from ICB by Sy&Se, the Adhera technolgy significantly improves the adherence of thin layers such as PVD, CVD, and galvanoplasty. For example, an AdHera post-processed thin film offers better mechanical resistance when the substrate material is subjected to minor deformation.
The initial R&D effort was driven by the watchmaking industry. Since then, our award-winning and patented ICB technology is on the tech roadmap of international prime companies in many industrial fields. Today, it is closely followed by its derivative AdHera, an enhancer for deposited thin films.
Whilst the semiconductor industry largely relies on classic Anodic Bonding, Sy&Se's ICB offers not only a smooth alternative that dramatically lowers the bonding time and temperatures north of 120°C: It also allows to bond novel material pairs needed for cutting-edge applications in power electronics, optronics, 5G telecom and more.
Watchmaking is “assembly par excellence“, as it includes a vast variety of critical joints where adhesives are today's suboptimal solution due to quality issues and ageing. ICB provides cost effective and long-lasting alternatives, whereas AdHera further increases the surface's durability of such valuable watches and luxury goods.
The frantic race for performance in connected mobiles requires relentless innovation in microelectronics, materials science and production methods. Sy&Se's patented ICB and AdHera technologies also make it possible to meet such challenges posed by displays and HMI, 5G components, antennas, optronics and packaging.
Due to its extreme environments and high reliability requirements, Aerospace is a prime application domain for Sy&Se's technologies: MEMS, packaging of embedded electronics, RF or electro-optical devices and sensors are just a few of them that can strongly benefit from the low temperature, high tightness bonding technologies.
Sy&Se SA is a spin-off from Haute Ecole Arc Ingénierie (HE-Arc) which specializes in assembling glass to metals and ceramics. Based on a major scientific discovery, Sy&Se offers 2 patented processing technologies: