Low temperature assembly of glass to metals and ceramics

Our technology is innovative, strong, durable, hermetic, low-stress and works without additives materials.

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Technologies

ICB

With its principles discovered in 2016 and developed further by Sy&Se since, the Impulse Current Bonding (ICB) technology allows different glass types to be bonded to ceramics and to metals such as stainless steels, medical titanium and supra-conductive alloys.

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AdHera

Derived from ICB by Sy&Se, this technology allows to dramatically improve the adherence of thin layers such as PVD, CVD, and galvanoplasty. Furthermore, an AdHera post-processed thin film offers better resistance when the substrate material is subject to minor deformation.

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Applications

The initial R&D effort was driven by the watchmaking industry. Since then, our award-winning and patented ICB technology is on the tech roadmap of international prime companies in many industrial fields. Today, it is closely followed by its derivative AdHera, an enhancer for deposited thin films.

Semiconductors

Whilst the semiconductor industry largely relies on classic Anodic Bonding, Sy&Se's ICB offers not only a smooth alternative that dramatically lowers the bonding time and temperatures north of 120°C: It also allows to bond novel material pairs needed for cutting-edge applications in power electronics, optronics, 5G telecom and more.

Watchmaking and Luxury Goods

Watchmaking is “assembly par excellence“, as it includes a vast variety of critical joints where adhesives are today's suboptimal solution due to quality issues and ageing. ICB provides cost effective and long-lasting alternatives, whereas AdHera further increases the surface's durability of such valuable watches and luxury goods.

Mobile devices and telecom

The frantic race for performance in connected mobiles requires relentless innovation in microelectronics, materials science and production methods. Sy&Se's patented ICB and AdHera technologies also make it possible to meet such challenges posed by displays and HMI, 5G components, antennas, optronics and packaging.

Aerospace

Due to its extreme environments and high reliability requirements, Aerospace is a prime application domain for Sy&Se's technologies: MEMS, packaging of embedded electronics, RF or electro-optical devices and sensors are just a few of them that can strongly benefit from the low temperature, high tightness bonding technologies.

About us

Sy&Se SA is a spin-off from Haute Ecole Arc Ingénierie (HE-Arc) which specializes in assembling glass to metals and ceramics. Based on a major scientific discovery, Sy&Se offers 2 patented processing technologies:

  • ICB (Impulse Current Bonding), to join glass to metals and ceramics in a robust and cost-effective manner
  • AdHera, a derivative of ICB, which can dramatically enhance the adherence of thin films such as PVD, CVD, galvanoplasty in a post-processing step.

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