Sy&Se SA specializes in bonding glass to metals and ceramics at low temperature. Its award-winning, patented Impulse Current Bonding (ICB) technology was industrialized in close collaboration with equipment manufacturers. Rigorously tested, it supports a wide range of applications aligned with the roadmaps of leading global high-tech companies.
Applications cover Semiconductors and MEMS, Mobile Devices and Telecom, Aerospace and MedTech, and Watchmaking and Luxury Goods.
Semiconductors
The semiconductor industry mainly relies on anodic or complex bonding processes. Sy&Se's ICB offers a seamless alternative, cutting bonding time and reducing temperatures to 100–250°C. It also enables bonding of novel material pairs – crucial for AI chips, photonics, power electronics, optronics, and advanced 5G and 6G telecom.