Sy&Se SA specializes in bonding glass to metals and ceramics at low temperature. Its award-winning, patented Impulse Current Bonding (ICB) technology was industrialized in close collaboration with equipment manufacturers. Rigorously tested, it supports a wide range of applications aligned with the roadmaps of leading global high-tech companies. The applications cover Semiconductors and MEMS, Mobile Devices, Telecom, Aerospace, MedTech, Watchmaking, and Luxury Goods.
Semiconductors
The semiconductor industry mainly relies on anodic or complex bonding processes. Sy&Se's ICB offers a seamless alternative, cutting bonding time and reducing temperatures to 120–240°C. It also enables bonding of novel material pairs – crucial for AI chips, power electronics, optronics, and advanced 5G and 6G telecom.