Sy&Se identified on the Permanent Bonding equipment vendors landscape!

The newest release of Yole’s Lithography and Bonding Equipment for More-than-Moore 2021 report, Yole Développement, 2021 now mentions Sy&Se bonding equipment capabilities. It underlines Sy&Se’s strategic step to provide the market with disruptive wafer bonding technology, which dramatically reduces both the bonding cycle time and the required temperature levels.