The ICB technology

With its principles discovered in 2016 and further developed since, the Impulse Current Bonding (ICB) technology allows different types of glasses to be bonded to ceramics and to metals such as stainless steels, medical titanium and supra-conductive alloys.

By playing with energy at the materials’ interface, this disruptive technology leads to a restructuring of the materials to bond, creating a composite with perfect sealing and strong mechanical properties, without distorting the final product.

An assembly by ICB is a perfect alternative to most assembly techniques such as gluing, soldering, anodic bonding, direct bonding, etc. – all of which have many significant drawbacks.

Unique Selling Points

Perfect sealing: Whilst ensuring perfect sealing at the interface, ICB remains tolerant to roughness. Assemblies by ICB were tested with helium detectors and approved in very low-pressure, in alkaline environments and under stress.

High mechanical resistance: By combining the materials to bond into a composite, assemblies by ICB create a composite interface material which offers a greater adherence to glass.

Low internal stress: Executed at low temperature with no materials added, an ICB assembly of materials with different CTEs keeps internal stress levels to a strict minimum, thus avoiding distortion or bending of the product.

Perfect aesthetics: Sy&Se’s multi-disciplinary expertise and its controlled environment guarantee an assembly with the perfect rendering.

High durability: The creation of a stable material allows for strong and durable assemblies – maximizing the cost of ownership.

Highly tolerant: This bonding process between substrates is currently carried out in an industrial environment and does not require a controlled environment or a polishing step.

Biocompatible: As there is no addition of material, the assembly is perfect for medical environments.

Environmentally friendly: Both the ICB’s low energy consumption compared to incumbent technologies and the avoidance of bonding chemicals make this assembly process fit for future.


Sy&Se is working relentlessly on developing recipes for new materials combinations. As of today, more than 30 combinations can be offered. Some of these are quite exotic; they provide cutting-edge customer developments with compelling alternatives to complex and suboptimal bonding processes.

More and more, it becomes obvious that ICB has a tremendous potential as a transverse technology, spanning over a wide field of applications and markets.