We are proud to announce that the federal agency Innosuisse selected Sy&Se SA with a few other promising Swiss companies for the second phase their “Scaleup“ programme ! This is a great recognition of its huge potential. Sy&Se will benefit from the support of recognised experts to accelerate its growth.
Author: Peter Kupferschmied
Sy&Se is moving!
Dear customers, partners and friends of Sy&Se,
We would like to wish you all the best for the New Year and hope that you have had a good holiday season.
For us, the end of 2022 has been full of events, as we have, in addition to our numerous client projects, prepared and actively followed the renovation of our new premises at Avenue des Pâquiers 20, in Saint-Blaise, Switzerland.
This site of more than 800 m2, easily accessible and close to all of Neuchâtel’s amenities, provides our growing company with enough room to regroup all its development, production and subcontracting activities. It offers far more office and meeting space, a clean room for R&D and application engineering, and large floor space for ICB kit assembly and low volume Adhera production for key customers.
This is another milestone in the development of Sy&Se and we would like to thank all those who have made it possible – our top customers who trust us, our partners and of course the entire Sy&Se team and those around them!
We look forward to welcoming you in Saint-Blaise soon!
Sy&Se enters exclusive Partnership with SUSS MicroTec SE for the Semicon market
SÜSS MicroTec SE, a leading supplier of equipment and process solutions for the semiconductor industry, paves the way for a novel low-temperature field-assisted bonding technology called Impulse Current Bonding. The technology developed and supplied by Sy&Se SA will be made available on both manual and automatic wafer bonder systems.
The technology will be introduced at the Semicon Europa trade show in Munich. More information on Impulse Current Bonding can be found here: https://icb.suss.com
Sy&Se welcomes you at EPHJ Geneva, 14th – 17th June 2022
Stop by at our Booth M94 and meet our team at the EPHJ – the World of High Precision – at Palexpo Geneva from 14th to 17th June 2022.
Here some reading about the 2021 edition (in French)
Our team is growing – Welcome to our new colleagues!
We have the great pleasure to welcome our new colleagues Thierry, Frédérique and Cédric during these months.
The skills they bring to Sy&Se SA ideally complement the talents already deployed and will allow us to meet the high expectations on the projects our customers have entrusted to us in our various fields of activity – currently in the semiconductor, ASD, watchmaking and luxury industries.
Sy&Se SA becomes a member of CeramEurop !
We are pleased to join CeramEurop on 1st January 2022. Based in Limoges and Toulouse, this unique European Cluster of Ceramics (ECC) is considered as an expert in the field. The cluster brings together more than 150 members, mainly in France, but also e.g. in Germany, Switzerland, Portugal, Belgium, and Italy.
Sy&Se’s core business is perfectly aligned with both the strategy areas – Luxury & Design, Transport & Energy and Electronics & Photonics – and the technologies – Surface Treatment and Factory of the Future.
We look forward to fruitful exchanges and collaborations!
Good press coverage of Sy&Se at the EPHJ
ArcInfo’s author Luc-Olivier Erard, honoured us with his report on Sy&Se (3), chosen among the 90 Neuchâtel exhibitors present at the 2021 edition of the EPHJ. Thank you so much!
Sy&Se identified on the Permanent Bonding equipment vendors landscape!
The newest release of Yole’s Lithography and Bonding Equipment for More-than-Moore 2021 report, Yole Développement, 2021 now mentions Sy&Se bonding equipment capabilities. It underlines Sy&Se’s strategic step to provide the market with disruptive wafer bonding technology, which dramatically reduces both the bonding cycle time and the required temperature levels.
Meet with the Sy&Se team at the EPHJ 2021 in Geneva
Sy&Se SA looks forward to welcoming you at its boot K102 at the EPHJ – the World of High Precision – at Palexpo Geneva from 14th to 17th September 2021.