With its principles discovered in 2016 and further developed since, the patented Impulse Current Bonding (ICB) technology allows different types of glasses to be bonded to ceramics and to metals such as stainless steels, titanium and aluminium, at low temperature.
The principles
By playing with energy at the interface of the materials to join, the disruptive ICB technology leads to a restructuring of these materials at the joint surfaces, creating a composite material with strong mechanical properties and perfect sealing – without distorting the final product.
An assembly by ICB is an interesting alternative to most assembly techniques such as gluing, soldering, anodic bonding, direct bonding, etc. – all of which suffer from significant technical or cost drawbacks. Moreover, ICB was the starting point to its derivative the AdHera technology, which strongly improves the adherence of thin films such as PVD, CVD, and galvanoplasty.
The differentiators
High mechanical strength: By combining the materials to bond into a composite, assemblies by ICB create a composite interface material which offers a greater adherence to glass.
Perfect sealing: Whilst ensuring perfect hermeticity at the interface, ICB remains tolerant to roughness. Assemblies by ICB were tested with helium detectors and approved in very low-pressure, in alkaline environments and under stress.
Low internal stress: Executed at low temperature with no materials added, an ICB assembly of materials with different CTEs keeps internal stress levels at a strict minimum, thus avoiding distortion or bending of the product.
Perfect aesthetics: Sy&Se’s multi-disciplinary expertise and its controlled environment guarantee an assembly with the perfect rendering.
High durability: The creation of a stable material allows for strong and durable assemblies – maximizing the cost of ownership.
Highly tolerant: This bonding process between substrates is currently carried out in an industrial environment and does not require a controlled environment or a polishing step.
Environmentally friendly: Both the ICB’s low energy consumption compared to incumbent technologies and the avoidance of bonding chemicals make this assembly process fit for future.
Biocompatible: As there is no addition of material, the assembly is perfect for medical environments.
The materials
Sy&Se is working relentlessly on developing recipes for new materials combinations for applications in different markets. Some of these are quite exotic; they provide cutting-edge customer developments with compelling alternatives to complex and suboptimal bonding processes.
Continuous progress on material pairs and applications demonstrate the tremendous potential of ICB as a transverse technology, spanning over a wide field of applications and markets.
Reach out to us with your questions and technical challenges!